If you want to heat sink a SoC, motor driver, or other surface-mount package part, you might find yourself struggling to find a good heat sink. These sinks from Cool Innovations are beloved by our favorite engineers for their low cost, ease of use and low thermal resistance!
The heat sink is a 0.27" x 0.27" (6.7mm x 6.7mm) square with four round 'fins' sticking out the top. The total height is 0.3" (7.6mm) but you can easily file it down if you need a shorter heat sink to fit in a case). Simply use thermal tape or a small amount of thermal paste to attach to the top of any flat chip. There is no thermal tape included with this product. Ideal for medium flat BGAs, TSSOPs, QFNs, etc!
In still air, the thermal resistance is approximately 70ēC/W